WO2002090243A3 - Thick sandwich wafer for mems fabrication - Google Patents

Thick sandwich wafer for mems fabrication Download PDF

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Publication number
WO2002090243A3
WO2002090243A3 PCT/GB2002/002009 GB0202009W WO02090243A3 WO 2002090243 A3 WO2002090243 A3 WO 2002090243A3 GB 0202009 W GB0202009 W GB 0202009W WO 02090243 A3 WO02090243 A3 WO 02090243A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
wafer substrate
tilted
soi
relatively large
Prior art date
Application number
PCT/GB2002/002009
Other languages
French (fr)
Other versions
WO2002090243A2 (en
Inventor
Paul Blaire
Jean Podlecki
Original Assignee
Alcatel Optronics Uk Ltd
Paul Blaire
Jean Podlecki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Optronics Uk Ltd, Paul Blaire, Jean Podlecki filed Critical Alcatel Optronics Uk Ltd
Publication of WO2002090243A2 publication Critical patent/WO2002090243A2/en
Publication of WO2002090243A3 publication Critical patent/WO2002090243A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00142—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/004—Angular deflection
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0104—Chemical-mechanical polishing [CMP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

Abstract

An improved method of manufacturing MEMS devices having relatively large components, such as large diameter micro mirrors, which require to be tilted at an angle to the wafer substrate, or displaced generally vertically, is described. In the described embodiment an SOI wafer having a sacrificial oxide layer at least 20 νm thick is formed. This provides sufficient space between the wafer substrate and a component formed in the upper silicon layer to allow a relatively large component to be tilted or displaced by a desired amount relative to the wafer substrate, The SOI wafer may be formed by bonding two separate SOI wafers together, A MEM device formed according to the method is also claimed.
PCT/GB2002/002009 2001-05-04 2002-05-02 Thick sandwich wafer for mems fabrication WO2002090243A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0110932A GB2375185A (en) 2001-05-04 2001-05-04 Thick wafer for MEMS fabrication
GB0110932.1 2001-05-04

Publications (2)

Publication Number Publication Date
WO2002090243A2 WO2002090243A2 (en) 2002-11-14
WO2002090243A3 true WO2002090243A3 (en) 2003-12-24

Family

ID=9914011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/002009 WO2002090243A2 (en) 2001-05-04 2002-05-02 Thick sandwich wafer for mems fabrication

Country Status (2)

Country Link
GB (1) GB2375185A (en)
WO (1) WO2002090243A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE533992C2 (en) 2008-12-23 2011-03-22 Silex Microsystems Ab Electrical connection in a structure with insulating and conductive bearings
CN110703428A (en) * 2019-10-28 2020-01-17 京东方科技集团股份有限公司 Light modulation mirror, manufacturing method thereof and light modulation device
CN113640983B (en) * 2021-08-11 2022-07-01 李青云 Anti-suction flat plate type MEMS galvanometer

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0657760A1 (en) * 1993-09-15 1995-06-14 Texas Instruments Incorporated Image simulation and projection system
EP0888888A2 (en) * 1997-06-05 1999-01-07 Xerox Corporation A magnetically actuated ink jet printing device
WO1999003681A1 (en) * 1997-07-15 1999-01-28 Silverbrook Research Pty. Limited A thermally actuated ink jet
US6016217A (en) * 1995-06-30 2000-01-18 Cms Mikrosystene Gmbh Chemnitz Micro swivel actuators and a procedure for the production of the same
DE19847305A1 (en) * 1998-10-14 2000-04-20 Bosch Gmbh Robert Micromechanical device, especially an oscillating mirror, is produced by electrodepositing a device element onto a quasi-insular attachment region and an adjacent region of a bond layer
US6213589B1 (en) * 1997-07-15 2001-04-10 Silverbrook Research Pty Ltd. Planar thermoelastic bend actuator ink jet printing mechanism

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2239101B (en) * 1989-11-17 1993-09-22 Marconi Gec Ltd Optical device
US5914801A (en) * 1996-09-27 1999-06-22 Mcnc Microelectromechanical devices including rotating plates and related methods
US6201629B1 (en) * 1997-08-27 2001-03-13 Microoptical Corporation Torsional micro-mechanical mirror system
US6074890A (en) * 1998-01-08 2000-06-13 Rockwell Science Center, Llc Method of fabricating suspended single crystal silicon micro electro mechanical system (MEMS) devices
US6238581B1 (en) * 1998-12-18 2001-05-29 Eastman Kodak Company Process for manufacturing an electro-mechanical grating device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0657760A1 (en) * 1993-09-15 1995-06-14 Texas Instruments Incorporated Image simulation and projection system
US6016217A (en) * 1995-06-30 2000-01-18 Cms Mikrosystene Gmbh Chemnitz Micro swivel actuators and a procedure for the production of the same
EP0888888A2 (en) * 1997-06-05 1999-01-07 Xerox Corporation A magnetically actuated ink jet printing device
WO1999003681A1 (en) * 1997-07-15 1999-01-28 Silverbrook Research Pty. Limited A thermally actuated ink jet
US6213589B1 (en) * 1997-07-15 2001-04-10 Silverbrook Research Pty Ltd. Planar thermoelastic bend actuator ink jet printing mechanism
DE19847305A1 (en) * 1998-10-14 2000-04-20 Bosch Gmbh Robert Micromechanical device, especially an oscillating mirror, is produced by electrodepositing a device element onto a quasi-insular attachment region and an adjacent region of a bond layer

Also Published As

Publication number Publication date
GB2375185A (en) 2002-11-06
WO2002090243A2 (en) 2002-11-14
GB0110932D0 (en) 2001-06-27

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