WO1998023392A1 - Sonde acoustique multielements comprenant une electrode de masse commune - Google Patents
Sonde acoustique multielements comprenant une electrode de masse commune Download PDFInfo
- Publication number
- WO1998023392A1 WO1998023392A1 PCT/FR1997/002110 FR9702110W WO9823392A1 WO 1998023392 A1 WO1998023392 A1 WO 1998023392A1 FR 9702110 W FR9702110 W FR 9702110W WO 9823392 A1 WO9823392 A1 WO 9823392A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- acoustic
- transducers
- elements
- probe according
- tij
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 52
- 230000006978 adaptation Effects 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229920006254 polymer film Polymers 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 238000003384 imaging method Methods 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 description 13
- 239000011159 matrix material Substances 0.000 description 10
- 239000002609 medium Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000012736 aqueous medium Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
Definitions
- the field of the invention is that of acoustic transducers which can be used in particular in medical or underwater imaging.
- an acoustic probe comprises a set of piezoelectric transducers connected to an electronic control device via an interconnection network.
- piezoelectric transducers emit acoustic waves which, after reflection in a given medium, provide information concerning said medium.
- one or two acoustic adaptation blades of the quarter-wave type are fixed to the surface of the piezoelectric transducers, in order to improve the transfer of acoustic energy in said medium.
- These adaptation blades can be of the polymer type loaded with mineral particles, the proportions of which are adjusted to obtain the desired acoustic properties.
- these blades are shaped by molding or machining and then assembled by gluing on one of the faces of the piezoelectric transducers.
- the piezoelectric type transducers are mechanically separated by cutting a monolithic blade of piezoelectric material, for example PZT type ceramic. It is then also necessary to cut in the same way the associated acoustic adaptation layer or layers, in order to avoid any acoustic coupling between elementary transducers by means of this or these adaptation layers.
- the cutting of these adaptation layers and of the piezoelectric layer is therefore generally carried out simultaneously, for example using a diamond saw.
- Each elementary piezoelectric transducer must be connected on one side to ground and on the other to a positive contact (also called hot spot).
- the mass is located towards the propagation medium (for example the patient in the case of an acoustic ultrasound probe), that is to say that it must be on the side of the acoustic adaptation elements.
- the simultaneous cutting of the acoustic adaptation layers and of piezoelectric material has the consequence of also cutting the ground electrode, when the latter is constituted by a metal layer inserted between the acoustic adaptation material and the piezoelectric material. In the case of a one-dimensional array probe, the continuity of the ground electrode in one direction is preserved.
- One or more acoustic adaptation planks are glued in the same way.
- the underside of the first acoustic adaptation blade is metallized, which allows the masses to be brought back to the edges of the matrix.
- the assembly is cut (acoustic adaptation blades and piezoelectric material blade), in the direction Dx perpendicular to the direction Dy.
- the invention provides an acoustic probe comprising a continuous ground electrode inserted between elementary piezoelectric transducers decoupled from each other, and acoustic matching elements also decoupled from each other so as to solve the problem of the prior art.
- the subject of the invention is an acoustic probe comprising acoustic adaptation elements, elementary piezoelectric transducers and a network of interconnections connecting the acoustic transducers to an electronic device for controlling and processing the signal, characterized in that it comprises a continuous ground electrode inserted between the elementary acoustic transducers and acoustic adaptation elements.
- the ground electrode can typically be a metallic foil, for example, copper or silver.
- the acoustic adaptation elements can advantageously be made of epoxy resin charged with tungsten and / or alumina particles, while the elementary piezoelectric transducers can be made of PZT type ceramic.
- the acoustic probe comprises acoustic adaptation elements Aij-
- the piezoelectric transducers being made of ceramic
- have an impedance of the order of 2 to 3 Mega Rayleigh
- the AiJ2 elements have an impedance of the order of 8 to 9 Mega Rayleigh.
- the invention also relates to a method of manufacturing the acoustic probe according to the invention.
- This method comprising the production of elementary piezoelectric transducers (Tij) on the surface of an interconnection network connecting the acoustic transducers to a control and signal processing device is characterized in that it further comprises the following steps: - the deposition of a conductive layer constituting a ground electrode (P), on the surface of the elementary transducers (Tij);
- the selective etching can be carried out by a CO2 type laser, an Excimer type UV laser or even a YAG type laser.
- the mass electrode can be a metallized copper polyimide film
- the acoustic adaptation elements Aij can then be defined by CO2 laser engraving with an energy density of the order of a few Joules per cm 2 (so as not to attack the metallization) of a layer of epoxy resin charged with tungsten particles.
- two layers of acoustic adaptation material are deposited, a first layer having an impedance close to that of the piezoelectric transducers, a second layer having an impedance close to that of the medium in which the acoustic probe is intended to operate.
- the whole of the two layers is etched with attack stop on the conductive layer.
- an impedance layer close to that of the transducers and conductive is deposited on the surface of a layer of piezoelectric material, the assembly is cut so as to define the piezoelectric transducers Tij and a first series of high impedance acoustic adaptation elements.
- a conductive layer of ground electrode is deposited on all of the Tij transducers covered with the elements A ⁇ j-j.
- a second acoustic adaptation layer is affixed to the surface of the ground electrode P, elements AiJ2 are then defined by selective cutting of the low impedance layer with etching stop on the ground electrode.
- FIG. 1 illustrates an acoustic probe according to the prior art
- FIG. 2 illustrates a first example of an acoustic probe according to the invention
- FIG. 3 illustrates a first step in manufacturing an example of an interconnection network, used in an acoustic probe according to the invention
- FIG. 4 illustrates a second manufacturing step of an example of an interconnection network, used in an acoustic probe according to the invention
- FIG. 5 illustrates a step in the method of manufacturing an acoustic probe common to the method of the prior art and to the method of the invention
- FIG. 6 illustrates a step in the method of manufacturing an acoustic probe according to the invention, comprising depositing a conductive layer on the surface of the elementary transducers Tij;
- FIG. 7 illustrates a step in the method of manufacturing an acoustic probe according to the invention, comprising depositing acoustic adaptation blades;
- FIG. 8 illustrates a step in the method of manufacturing an acoustic probe according to the invention comprising the selective cutting of the acoustic adaptation blades so as to define the elements Aij;
- FIG. 9 illustrates a second example of an acoustic probe according to the invention.
- the acoustic probe according to the invention comprises piezoelectric elementary transducers (organized in a linear matrix or preferably two-dimensional) Tij, transferred to a matrix of opposite interconnection pads.
- This matrix of interconnections is formed by the ends of metal tracks emerging on one of the faces of an interconnection network described below and called "backing".
- the opposite ends of the metal tracks are generally connected to an electronic control and analysis device.
- FIG. 2 illustrates a first example of an acoustic probe according to the invention in which the entire probe appears partially cut.
- the "backing" 1 supports the elementary piezoelectric transducers Tij.
- a continuous ground electrode P is affixed to the surface of the transducers Tij and supports all of the discrete acoustic adaptation elements Aij which may result from the deposition of one or more layers of acoustic adaptation material (in the example of Figure 2, two layers are shown and lead to obtaining elements Aij-
- the interconnection network can in particular be produced in the following manner: M dielectric substrates are used on which have been produced
- Each substrate may include a window locally leaving the conductive tracks bare. All of the M substrates are aligned and stacked in a direction Dy. A stack of M dielectric substrates is thus obtained, said stack having a cavity comprising MxN conductive tracks.
- Fig 3 illustrates the construction of this stack.
- the cavity thus formed is filled with a curable resin which is electrically insulating and has the desired acoustic attenuation properties.
- the stack is cut along a plane Pc, perpendicular to the axis of the tracks at the level of the preformed cavity as illustrated in FIG. 4, in order to produce a surface made up of MxN sections of tracks flush perpendicularly the resin, at the backing 1.
- FIG. 5 illustrates the matrix of transducers Tij defined on elementary metallizations Me corresponding to the "hot spot" contacts mentioned previously, the assembly thus being electrically connected to the backing 1.
- the assembly thus formed is covered by an electrode of conductive mass P, as illustrated in FIG. 6, affixed and then bonded, whether it is a metal sheet or a film of metallized polymer.
- the first blade L1 has a high impedance close to that of the material of the transducers
- the second blade L2 has a lower impedance near the environment in which we want to use the acoustic probe.
- the cut must mechanically separate the adapter blades without cutting the ground electrode P.
- this cutting can be carried out by laser.
- the laser used can be, for example, an infrared laser of the CO2 type or a UV laser of the Excimer type or of the tripled or quadrupled YAG type.
- the acoustic probe comprises two series of acoustic adaptation elements Aij-
- This probe includes elementary transducers Tij, transferred to a matrix of facing interconnection pads forming part of an interconnection network.
- Figure 9 illustrates this configuration.
- the first series of high-impedance acoustic adaptation elements can be defined at the same time as the piezoelectric elements from the cutting, for example by sawing of the previously mentioned metallization layer Me, of the ceramic layer (constituting the elementary transducers) and a first acoustic adaptation blade L1, which must be conductive.
- electrodes Me The assembly thus constituted, electrodes Me, transducers Tij, elements Aij-
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK97947120T DK0883447T3 (da) | 1996-11-26 | 1997-11-21 | Akustisk sonde med flere elementer indbefattede en fælles jordelektrode |
EP97947120A EP0883447B1 (fr) | 1996-11-26 | 1997-11-21 | Sonde acoustique multielements comprenant une electrode de masse commune |
DE69710314T DE69710314T2 (de) | 1996-11-26 | 1997-11-21 | Schallwandler mit mehreren elementen und gemeinsamer massenelektrode |
JP10524353A JP2000504274A (ja) | 1996-11-26 | 1997-11-21 | 共通のアース電極を含む複数要素音響プローブ |
US09/117,045 US6341408B2 (en) | 1996-11-26 | 1997-11-21 | Method of manufacturing a multiple-element acoustic probe comprising a common ground electrode |
CA 2243291 CA2243291A1 (fr) | 1996-11-26 | 1997-11-21 | Sonde acoustique multielements comprenant une electrode de masse commune |
NO983363A NO983363L (no) | 1996-11-26 | 1998-07-21 | Akustisk sonde med multielementer omfattende felles jordelektrode |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9614472A FR2756447B1 (fr) | 1996-11-26 | 1996-11-26 | Sonde acoustique multielements comprenant une electrode de masse commune |
FR96/14472 | 1996-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998023392A1 true WO1998023392A1 (fr) | 1998-06-04 |
Family
ID=9498040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR1997/002110 WO1998023392A1 (fr) | 1996-11-26 | 1997-11-21 | Sonde acoustique multielements comprenant une electrode de masse commune |
Country Status (10)
Country | Link |
---|---|
US (1) | US6341408B2 (fr) |
EP (1) | EP0883447B1 (fr) |
JP (1) | JP2000504274A (fr) |
KR (1) | KR100508222B1 (fr) |
CN (1) | CN1105039C (fr) |
DE (1) | DE69710314T2 (fr) |
DK (1) | DK0883447T3 (fr) |
FR (1) | FR2756447B1 (fr) |
NO (1) | NO983363L (fr) |
WO (1) | WO1998023392A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2810907A1 (fr) * | 2000-06-30 | 2002-01-04 | Thomson Csf | Procede de fabrication d'une sonde acoustique multielements utilisant une nouvelle methode de realisation de la masse electrique |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2770932B1 (fr) | 1997-11-07 | 2001-11-16 | Thomson Csf | Procede de fabrication d'une sonde acoustique |
FR2779575B1 (fr) * | 1998-06-05 | 2003-05-30 | Thomson Csf | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication |
FR2802449B1 (fr) * | 1999-12-17 | 2002-03-01 | Thomson Csf | Sonde acoustique lineaire multi-elements et procede de fabrication collective de sondes acoustiques |
DE60139444D1 (de) * | 2000-02-22 | 2009-09-17 | Nxp Bv | Verfahren zur herstellung eines auf einem trägersubstrat geformten piezoelektrischen filters mit einem akustischen resonator auf einer akustischen reflektorschicht |
FR2806332B1 (fr) * | 2000-03-14 | 2002-06-14 | Thomson Csf | Sonde acoustique unidirectionnelle et procede de fabrication |
FR2815723B1 (fr) * | 2000-10-24 | 2004-04-30 | Thomson Csf | Procede systeme et sonde pour l'obtention d'images par l'intermediaire d'ondes emises par une antenne apres reflexion de ces ondes au niveau d'un ensemble servant de cible |
FR2818170B1 (fr) * | 2000-12-19 | 2003-03-07 | Thomson Csf | Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse |
US6759791B2 (en) * | 2000-12-21 | 2004-07-06 | Ram Hatangadi | Multidimensional array and fabrication thereof |
US6864620B2 (en) * | 2000-12-22 | 2005-03-08 | Ngk Insulators, Ltd. | Matrix type actuator |
JP3883823B2 (ja) * | 2001-06-19 | 2007-02-21 | 日本電波工業株式会社 | マトリクス型の超音波探触子及びその製造方法 |
US6859984B2 (en) * | 2002-09-05 | 2005-03-01 | Vermon | Method for providing a matrix array ultrasonic transducer with an integrated interconnection means |
US20040220531A1 (en) * | 2003-05-01 | 2004-11-04 | Bui Tuan S. | System and method operating microreservoirs delivering medication in coordination with a pump delivering diluent |
JP4503347B2 (ja) * | 2004-04-28 | 2010-07-14 | 日本電波工業株式会社 | 超音波探触子の製造方法 |
JP4513596B2 (ja) * | 2004-08-25 | 2010-07-28 | 株式会社デンソー | 超音波センサ |
JP4469928B2 (ja) * | 2004-09-22 | 2010-06-02 | ベックマン・コールター・インコーポレーテッド | 攪拌容器 |
JP4693386B2 (ja) * | 2004-10-05 | 2011-06-01 | 株式会社東芝 | 超音波プローブ |
FR2889403B1 (fr) * | 2005-07-29 | 2007-11-09 | Thales Sa | Procede de fabrication d'un transducteur acoutique |
US20070046149A1 (en) * | 2005-08-23 | 2007-03-01 | Zipparo Michael J | Ultrasound probe transducer assembly and production method |
US7622848B2 (en) * | 2006-01-06 | 2009-11-24 | General Electric Company | Transducer assembly with z-axis interconnect |
JP5002402B2 (ja) * | 2007-10-03 | 2012-08-15 | 株式会社東芝 | 超音波探触子及び超音波診断装置 |
DE102008055116A1 (de) * | 2008-12-23 | 2010-07-01 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Ultraschallwandlers |
JP5643667B2 (ja) | 2011-01-28 | 2014-12-17 | 株式会社東芝 | 超音波トランスデューサ、超音波プローブおよび超音波トランスデューサの製造方法 |
US9530955B2 (en) | 2011-11-18 | 2016-12-27 | Acist Medical Systems, Inc. | Ultrasound transducer and processing methods thereof |
KR101387187B1 (ko) * | 2012-02-24 | 2014-04-21 | 경북대학교 산학협력단 | 다차원 배열 초음파 트랜스듀서의 제작 기법 |
US9536511B2 (en) * | 2013-12-31 | 2017-01-03 | Acist Medical Systems, Inc. | Ultrasound transducer stack |
CN105596027B (zh) * | 2014-11-05 | 2018-07-17 | 香港理工大学深圳研究院 | 基于三维超声成像的二维阵列超声换能器及其制备方法 |
KR20160086709A (ko) * | 2015-01-12 | 2016-07-20 | 삼성메디슨 주식회사 | 정합 부재 및 이를 포함한 초음파 프로브 |
CN109475348B (zh) * | 2016-05-20 | 2022-04-19 | 奥林巴斯株式会社 | 超声波振子组件、超声波内窥镜以及超声波振子组件的制造方法 |
CN106124618B (zh) * | 2016-06-21 | 2018-10-02 | 济南大学 | 一种用于水泥混凝土水化反应进程监测的超声传感器 |
KR101830205B1 (ko) * | 2017-02-17 | 2018-02-21 | 주식회사 베프스 | 압전 센서 제조 방법 및 이를 이용한 압전 센서 |
US10710116B2 (en) * | 2017-09-21 | 2020-07-14 | General Electric Company | Methods and systems for manufacturing an ultrasound probe |
CN109985796A (zh) * | 2019-03-25 | 2019-07-09 | 中国船舶重工集团公司第七一五研究所 | 一种多边形阵元压电复合材料换能器制备方法 |
US11883846B2 (en) * | 2019-06-14 | 2024-01-30 | GE Precision Healthcare LLC | Method for manufacturing an ultrasound transducer and ultrasound probe |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57147397A (en) * | 1981-03-09 | 1982-09-11 | Hitachi Medical Corp | Ultrasonic probe |
EP0210723A1 (fr) * | 1985-05-20 | 1987-02-04 | Matsushita Electric Industrial Co., Ltd. | Transducteur ultrason |
WO1991011960A1 (fr) * | 1990-02-08 | 1991-08-22 | Credo Group, Inc. | Lentille ultrasonique de haute energie a facettes de montage |
US5274296A (en) * | 1988-01-13 | 1993-12-28 | Kabushiki Kaisha Toshiba | Ultrasonic probe device |
US5423220A (en) * | 1993-01-29 | 1995-06-13 | Parallel Design | Ultrasonic transducer array and manufacturing method thereof |
EP0707898A2 (fr) * | 1994-10-21 | 1996-04-24 | Hewlett-Packard Company | Procédé pour former intégralement un transducteur et des couches d'adaptation d'impédance |
WO1997017145A1 (fr) * | 1995-11-03 | 1997-05-15 | Thomson-Csf | Sonde acoustique et procede de realisation |
EP0779108A2 (fr) * | 1995-12-13 | 1997-06-18 | Gec-Marconi Limited | Réseaux pour l'imagerie acoustique |
WO1997034528A1 (fr) * | 1996-03-22 | 1997-09-25 | Lockheed Martin Ir Imaging Systems, Inc. | Base de transducteurs d'ultrasons a interconnexions electriques d'attenuation |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2139151A1 (fr) * | 1994-01-14 | 1995-07-15 | Amin M. Hanafy | Reseau acoustique bidimensionnel et sa methode de fabrication |
-
1996
- 1996-11-26 FR FR9614472A patent/FR2756447B1/fr not_active Expired - Fee Related
-
1997
- 1997-11-21 CN CN97191814A patent/CN1105039C/zh not_active Expired - Fee Related
- 1997-11-21 DE DE69710314T patent/DE69710314T2/de not_active Expired - Lifetime
- 1997-11-21 EP EP97947120A patent/EP0883447B1/fr not_active Expired - Lifetime
- 1997-11-21 US US09/117,045 patent/US6341408B2/en not_active Expired - Lifetime
- 1997-11-21 WO PCT/FR1997/002110 patent/WO1998023392A1/fr active IP Right Grant
- 1997-11-21 KR KR1019980705547A patent/KR100508222B1/ko not_active IP Right Cessation
- 1997-11-21 DK DK97947120T patent/DK0883447T3/da active
- 1997-11-21 JP JP10524353A patent/JP2000504274A/ja active Pending
-
1998
- 1998-07-21 NO NO983363A patent/NO983363L/no unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57147397A (en) * | 1981-03-09 | 1982-09-11 | Hitachi Medical Corp | Ultrasonic probe |
EP0210723A1 (fr) * | 1985-05-20 | 1987-02-04 | Matsushita Electric Industrial Co., Ltd. | Transducteur ultrason |
US5274296A (en) * | 1988-01-13 | 1993-12-28 | Kabushiki Kaisha Toshiba | Ultrasonic probe device |
WO1991011960A1 (fr) * | 1990-02-08 | 1991-08-22 | Credo Group, Inc. | Lentille ultrasonique de haute energie a facettes de montage |
US5423220A (en) * | 1993-01-29 | 1995-06-13 | Parallel Design | Ultrasonic transducer array and manufacturing method thereof |
EP0707898A2 (fr) * | 1994-10-21 | 1996-04-24 | Hewlett-Packard Company | Procédé pour former intégralement un transducteur et des couches d'adaptation d'impédance |
WO1997017145A1 (fr) * | 1995-11-03 | 1997-05-15 | Thomson-Csf | Sonde acoustique et procede de realisation |
EP0779108A2 (fr) * | 1995-12-13 | 1997-06-18 | Gec-Marconi Limited | Réseaux pour l'imagerie acoustique |
WO1997034528A1 (fr) * | 1996-03-22 | 1997-09-25 | Lockheed Martin Ir Imaging Systems, Inc. | Base de transducteurs d'ultrasons a interconnexions electriques d'attenuation |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 006, no. 247 (E - 146) 7 December 1982 (1982-12-07) * |
SMITH S W ET AL: "TWO-DIMENSIONAL ARRAY TRANSDUCERS USING THICK FILM CONNECTION TECHNOLOGY", IEEE TRANSACTIONS ON ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, vol. 40, no. 6, 1 November 1993 (1993-11-01), pages 727 - 734, XP000415587 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2810907A1 (fr) * | 2000-06-30 | 2002-01-04 | Thomson Csf | Procede de fabrication d'une sonde acoustique multielements utilisant une nouvelle methode de realisation de la masse electrique |
Also Published As
Publication number | Publication date |
---|---|
KR100508222B1 (ko) | 2006-06-21 |
DK0883447T3 (da) | 2002-05-27 |
DE69710314T2 (de) | 2003-01-23 |
EP0883447A1 (fr) | 1998-12-16 |
US20010042289A1 (en) | 2001-11-22 |
JP2000504274A (ja) | 2000-04-11 |
NO983363L (no) | 1998-09-03 |
FR2756447B1 (fr) | 1999-02-05 |
CN1105039C (zh) | 2003-04-09 |
NO983363D0 (no) | 1998-07-21 |
US6341408B2 (en) | 2002-01-29 |
FR2756447A1 (fr) | 1998-05-29 |
KR19990081844A (ko) | 1999-11-15 |
EP0883447B1 (fr) | 2002-02-06 |
CN1209778A (zh) | 1999-03-03 |
DE69710314D1 (de) | 2002-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0883447B1 (fr) | Sonde acoustique multielements comprenant une electrode de masse commune | |
EP0801595B1 (fr) | Sonde acoustique et procede de realisation | |
US20180240960A1 (en) | Methods for manufacturing ultrasound transducers and other components | |
FR2847492A1 (fr) | Procede pour etablir une connexion electrique avec un transducteur ultrasonore a travers un materiau d'isolation acoustique | |
EP0354117B1 (fr) | Transducteur piézoélectrique pour générer des ondes de volume | |
EP0976101A1 (fr) | Dispositif hybride a contacts affleurants et a production de signaux acoustiques, et procede de fabrication | |
FR2862161A1 (fr) | Procede de fabrication d'un transducteur acoustique en ceramique multicouche | |
WO2004073892A1 (fr) | Procede de fabrication d’une sonde acoustique multielements, notamment d’une sonde d’echographe | |
EP0040559B1 (fr) | Dispositif convoluteur piézoélectrique à ondes élastiques | |
EP1084000A1 (fr) | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication | |
EP0664633B1 (fr) | Dispositif de production de signaux acoustiques, transmissibles par voie téléphonique | |
EP0951366A1 (fr) | Procede de fabrication d'une sonde acoustique | |
Brown et al. | Fabrication and performance of 40-60 MHz annular arrays | |
CA1298395C (fr) | Sonde d'appareil a ultrasons a barrette d'elements piezo-electriques | |
CA2243291A1 (fr) | Sonde acoustique multielements comprenant une electrode de masse commune | |
EP1345706A1 (fr) | Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse | |
EP1274518B1 (fr) | Sonde acoustique unidirectionnelle et procede de fabrication | |
CA1294700C (fr) | Sonde d'echographe a arrangement d'elements piezo-electriques | |
FR2802449A1 (fr) | Sonde acoustique lineaire multi-elements et procede de fabrication collective de sondes acoustiques | |
FR2546819A1 (fr) | Procede de fabrication de tetes d'impression electrostatique et tetes d'impression obtenues par sa mise en oeuvre |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 97191814.7 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CA CN JP KR NO US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1997947120 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2243291 Country of ref document: CA Ref document number: 2243291 Country of ref document: CA Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1019980705547 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 09117045 Country of ref document: US |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWP | Wipo information: published in national office |
Ref document number: 1997947120 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1019980705547 Country of ref document: KR |
|
WWG | Wipo information: grant in national office |
Ref document number: 1997947120 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 1019980705547 Country of ref document: KR |