US20040190246A1 - Removable fan module and electronic device incorporating same - Google Patents
Removable fan module and electronic device incorporating same Download PDFInfo
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- US20040190246A1 US20040190246A1 US10/396,535 US39653503A US2004190246A1 US 20040190246 A1 US20040190246 A1 US 20040190246A1 US 39653503 A US39653503 A US 39653503A US 2004190246 A1 US2004190246 A1 US 2004190246A1
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- fan
- recited
- electronic device
- removable
- retainer
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- 238000000034 method Methods 0.000 claims description 16
- 230000013011 mating Effects 0.000 claims description 5
- 238000001816 cooling Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
Definitions
- Electronic devices typically generate heat during operation due to the flow of electricity through the device. Some electronic components are susceptible to damage if this heat is not removed. Consequently, various methods have been developed to remove heat from within electronic devices and/or electronic components. Passive methods use natural convection to remove heat. For example, the electronic device may have a housing with vents to let cool air flow into the device and hot air flow out. Other electronic devices use active methods, such as electric fans built into the housing, to provide a flow of cooling air through the device.
- the processors in many processor-based devices are susceptible to heat damage. Consequently, at least one cooling fan usually is needed to remove the heat from the processor to prevent the processor from being damaged.
- a typical home computer has a cooling fan to remove the heat produced by the electronic components, including the processor, housed therein.
- several fans may be used to remove heat from within the device.
- redundant fans may be provided that are operable to respond when another fan fails, either by initiating operation or by increasing speed.
- fans may be used in electronic devices, such as processor-based devices.
- each type of fan typically requires its own unique method of installation.
- the securing methods may involve numerous parts, such as threaded fasteners.
- these fans typically are bulky and may not be disposed in a space-efficient side-by-side arrangement.
- fan connectors and finger guards may be oriented in such a manner that they interfere with the flow of air through the fan or otherwise add to the difficulty of installing the fan.
- a removable fan module comprises a first member securable to a fan.
- the first member comprises a portion adapted to engage a corresponding portion of an electrical device.
- an electronic device comprises a plurality of removable fan modules. At least one of the plurality of removable fan modules having a first type of fan and at least one of the plurality of removable fan modules having a second type of fan.
- the removable fan module comprises a fan retainer securable to the first and second type of fan. A portion of the electronic device and the fan retainer are adapted to enable the fan retainer to be received by the electronic device.
- a method of removably securing a plurality of fans within an electronic device comprises securing a common fan retainer to at least one of the plurality of fans, the common fan retainer being operable to secure the at least one of plurality of fans to the electronic device.
- the method comprises disposing the fans and common fan retainers within the electronic device to secure the plurality of fans to the electronic device.
- FIG. 1 illustrates a block-diagram of a processor-based system according to an embodiment of the present invention
- FIG. 2 is a perspective view illustrating an embodiment of a processor-based system, in accordance with an embodiment of the present invention
- FIG. 3 is a perspective view of a first removable fan of FIG. 2;
- FIG. 4 is a top view of a portion of the chassis of the processor-based system of FIG. 2;
- FIG. 5 is a front perspective view of a fan retainer illustrated in FIG. 3;
- FIG. 6 is a rear perspective view of the fan retainer of FIG. 5;
- FIG. 7 is a perspective view of a second removable fan of FIG. 2;
- FIG. 8 is a perspective view of a third removable fan of FIG. 2.
- FIG. 9 is a perspective view of a fourth removable fan, in accordance with an alternative embodiment of the present invention.
- FIG. 1 a block diagram is illustrated depicting an exemplary processor-based device, generally designated by reference numeral 20 .
- the processor-based device 20 may be any of a variety of different devices, such as a personal computer or a server.
- the illustrated processor-based device 20 uses a processor 22 to control the operation of device 20 .
- Processor 22 may be a microprocessor, such as used in a personal computer, or other type of processor.
- Processor-based device 22 has a power supply 24 to supply power to the other components of the system.
- Various additional components of system 20 may be coupled to processor 22 .
- a user interface 26 may be coupled to processor 22 to allow an operator to control some or all of the functions of the device. Examples of user interfaces include a keyboard, a mouse, or a joystick.
- a monitor 28 may be coupled to the processor 22 to allow an operator to view visual information provided by the device. This information may be displayed on the monitor via a graphical user interface.
- a communications port 30 also may be used to couple processor 22 to peripheral devices 32 , such as a modem or printer.
- Volatile memory may include dynamic random access memory (DRAM) and/or static random access memory (SRAM) packaged, for example, as a single-inline memory module (SIMM) or as a dual-inline memory module (DIMM).
- DRAM dynamic random access memory
- SRAM static random access memory
- SIMM single-inline memory module
- DIMM dual-inline memory module
- Processor 22 also may be coupled to non-volatile memory 36 .
- Non-volatile memory 36 may include a read only memory (ROM), such as an erasable programmable read-only memory (EPROM), to be used in conjunction with the volatile memory.
- ROM read only memory
- EPROM erasable programmable read-only memory
- the non-volatile memory 36 may include a high capacity memory such as a hard disk drive (HDD) or tape drive memory.
- processor-based device 38 is a server and comprises a chassis 40 and a number of electronic components housed within chassis 40 .
- Chassis 40 may comprise sheet metal, or other materials may be used.
- chassis 40 comprises a base 42 having sides 44 .
- a number of ventilation holes 46 are provided in chassis 40 .
- Chassis 40 also has a plurality of dividers 48 secured to base 42 that are used to separate various portions of the chassis and to secure components to base 42 .
- dividers 40 comprise folded sheet metal. However, other materials also may be used to construct dividers 40 .
- Several removable fans 50 are provided to produce a flow of air 52 through device 38 to cool the components housed therein.
- three different types of fan are utilized. However, fans of the same type or fans of other types may be used.
- fans 50 can have a variety of different dimensions. Ventilation holes 46 are oriented at each end of base 44 and the cover so that air 52 is drawn in at one end of the device and exited at the opposite end. However, other orientations of ventilation holes 46 may be used.
- Dividers 48 also may be used to guide the flow of air 52 through device 38 .
- processor-based-device 38 has a pair of processors 54 .
- a cover 56 is disposed over processors 54 to guide air 52 over the processors 54 .
- ducts 58 are provided to guide air 52 into cover 56 .
- two fan modules 60 of the plurality of fans 50 primarily are used to provide a flow of air 52 to cool processors 54 .
- Several different operating strategies may be used to operate fan modules 60 . In one strategy, both fan modules are operated at low speed. If one of the fan modules fails, then the speed of the other fan module is increased to compensate for the loss of the failed fan. Alternatively, only one fan module at a time may be operated.
- the non-operating fan is turned on to maintain the flow of air 52 .
- the flow of air 52 provided by fan modules 60 may cool other components located within the device 38 , such as power supplies 62 and optical drive 64 .
- other fan modules may assist in the cooling of the processors 54 .
- processor-based device 38 also comprises a plurality of DIMM's 66 .
- other memory modules may be used.
- a second fan module 68 primarily is utilized to provide a flow of air 52 to cool the DIMM's.
- Processor-based device 38 may also comprise a PCI cage 70 .
- PCI cage 70 houses a number of interface cards for connecting processor-based device 38 to an electronic communication system.
- Processor-based device 38 also comprises several HDDs 72 .
- a flow of air 52 for cooling the components within PCI cage 70 and the HDDs 72 is provided primarily by a third fan module 74 .
- third fan module 74 also may be used to cool other components and other fan modules may assist in the cooling of the components within PCI cage 70 and HDDs 72 .
- fan modules 60 , second fan module 68 , and third fan module 74 are hot-swap fans, i.e., these fans may be installed and removed without securing power to, or interrupting operation of, processor-based device 38 . Redundant fans are provided so that if one of the fans fails, operation of the device may continue until a replacement fan is installed.
- each fan is adapted to be blind-mated to a corresponding connector within chassis 40 when the fan is installed within device 38 .
- each fan receives power through the connectors, and fan operation, such as fan speed, may be controlled via signals transmitted via the connectors.
- the plurality of fans 50 utilize a common methodology for removably installing the fans within the chassis 40 .
- the common methodology enables installation and removal without the use of fasteners or tools.
- the common methodology enables fans of different dimensions to be installed with common components.
- the illustrated fan module 60 comprises a fan retainer 76 , a first fan 78 , and a Fan top piece 80 .
- Fan retainer 76 comprises a pair of mating flanges 82 adapted to slidingly engage a pair of catching flanges 84 located on a divider 48 secured to chassis 40 (See FIG. 4).
- Fan retainer 76 is utilized with all three types of fans described with respect to the illustrated embodiment.
- fan retainer 76 comprises a plastic material.
- Fan retainer 76 also comprises a pair of alignment notches 86 adapted to engage corresponding alignment tabs 88 located on base 42 of chassis 40 when there is proper alignment between fan module 60 and chassis 40 (See FIG. 4). Alignment tabs 88 prevent a fan module from being fully inserted when there is misalignment between the fan module and chassis 40 , thereby indicating misalignment to an installer.
- Fan modules are blocked from removal from chassis 40 by a cover 89 .
- fan module 60 may be adapted to accommodate a fan 78 .
- Fan 78 comprises a rotatable fan blade 90 driven by an electric motor and a fixed air guide downstream of rotatable fan blade 90 .
- a finger guard 92 is disposed on each end of fan module 60 to prevent a finger from contacting fan blade 90 .
- Fan retainer 76 may have a recess 94 on each corner. Each recess 94 is adapted to receive a portion of a finger guard 92 to secure finger guard 92 to fan retainer 76 .
- fan retainer 76 is secured to fan 78 by a plurality of rivets 98 .
- other fasteners may be used.
- Fan top piece 80 is adapted to electrically couple fan module 60 to a fan power system within processor-based device 38 .
- Fan top piece 80 is secured to fan module 60 by a tongue 100 that engages a slot in fan retainer 76 and by a plurality of rivets 102 secured to fan 78 through the fan top piece 80 .
- Fan top piece 80 also has a pair of finger grips 104 to facilitate gripping of fan module 60 .
- Fan top piece 80 also has an identifier 106 to indicate that this is a specific type of fan: in the illustrated embodiment a Type 1 fan.
- Fan module 60 has an inlet side 108 and an outlet side 110 .
- An arrow 112 is provided on fan top piece 80 to indicate the flow of air from the inlet side 108 to the outlet side 110 .
- fan retainer 76 is disposed on the inlet side 108 of the fan.
- fan retainer 76 may be disposed on the outlet side 110 of the fan.
- fan top piece 80 has a connector portion 114 housing a first electrical connector 116 .
- Connector 116 is coupled by power and control leads 118 to the motor of fan module 60 .
- Connector portion 114 forms a protective tray to protect power and control leads 118 .
- catching flanges 84 and a second electrical connector 120 are oriented within the chassis 40 to enable the first and second electrical connectors to be blind-mated when the first fan module 60 is inserted.
- first electrical connector 116 is guided into engagement with second electrical connector 120 .
- connector portion 114 of fan top portion 80 is cantilevered to displace first electrical connector 116 axially and in line with airflow through fan module 60 .
- This displacement enables two fan modules 60 to be installed within chassis 40 so that fans 78 are in close, side-by-side arrangement, as illustrated in FIG. 4.
- fans 78 are disposed approximately 1.5 mm from each other.
- alignment notches 86 and alignment tabs 88 facilitate the blind-mating of each fan module by preventing the fan module from being fully inserted when there is a misalignment between the fan module and chassis 40 .
- Second fan module 68 comprises a fan retainer 76 , a fan 122 , a fan 124 , and a second fan top piece 126 .
- Fan 122 and fan 124 each house a motor and fan blade.
- Second fan module 68 also may be used with a single fan having the same depth as fans 122 and 124 when placed together.
- Several different operating strategies also may be employed to operate fans 122 and 124 . For example, both fans may be operated at a low speed. If one of the fans fails, then the speed of the other fan is increased to compensate for the loss of the failed fan. Alternatively, only one fan at a time may be operated. If the operating fan fails, then the non-operating fan is turned on to maintain the flow of air 52 .
- Second fan top piece 126 is configured for use with second fan module 68 .
- Second fan top piece 126 also is adapted with a connector portion 128 .
- Connector portion 128 houses a first electrical connector 116 coupled by power and control leads 118 to the motors within second fans 122 and 124 .
- Connector portion 128 of second fan top piece 126 displaces first electrical connector 116 to the side of second fan module 68 , and transverse to the direction of airflow therethrough.
- Catching flanges 84 and second electrical connector 120 are oriented within the chassis 40 to connect the first and second electrical connectors when second fan module 68 is fully inserted into chassis 40 .
- first electrical connector 116 is guided into engagement with second electrical connector 120 .
- a plurality of fasteners 130 are employed to secure fan retainer 76 , fan 122 , fan 124 , and second fan top piece 126 together.
- Second fan top piece 126 also has tongue 100 adapted to extend under a portion of fan retainer 76 .
- second fan top piece 126 also has an identifier 132 to indicate the fan module type as a Type 2 fan.
- Second fan module 68 also has an inlet side 108 and an outlet side 110 .
- An arrow 112 is provided on Second fan top piece 126 to indicate the direction of airflow from the inlet side 108 to the outlet side 110 .
- fan retainer 76 is disposed on the inlet side 108 of the second-type fan module 68 .
- fan retainer 76 may be disposed on the outlet side 110 of fan module 68 .
- third fan module 74 is illustrated.
- Third fan module 74 comprises a fan retainer 76 , a fan 134 , and a third fan top piece 136 .
- fan 134 has two counter-rotating fan blades.
- Third fan module 74 also may be used with two fans having half the width of third fan 134 , etc.
- Third fan top piece 136 is configured for use with third-type fan module 74 .
- Third fan top piece 136 has a connector portion 138 housing a male electrical connector 116 coupled by power and control leads 118 to the motor within fan housing 134 .
- Connector portion 138 is adapted to enable first electrical connector 116 to be blind-mated with a corresponding second electrical connector 120 located on chassis 40 .
- third fan module 74 is guided into chassis 40 by the mating flanges 82 and catching flanges 84 , the first electrical connector 116 is guided into engagement with second electrical connector 120 .
- third fan top piece 136 also has an identifier 140 to indicate that this is a Type 3 fan.
- Third fan module 74 has an inlet side 108 and an outlet side 110 .
- An arrow 112 is provided on fan top portion 136 to indicate the direction of airflow from the inlet side 108 to the outlet side 110 .
- fan retainer 76 is disposed on the outlet side 110 of the second-type fan module 68 .
- fan retainer 76 may be disposed on the inlet side 108 of fan module 68 .
- fourth fan module 142 is illustrated.
- fourth fan module 142 is a non-hot swap fan module.
- Fourth fan module 142 comprises a fan retainer 76 , a fourth fan 144 , and a separate connector 146 connected by power and control leads 118 to the motor within fourth fan 144 .
- Fourth fan module 142 may be used instead of, or to replace, some or all of the plurality of fan modules 50 .
- fourth fan modules 142 may be used to replace fan modules 60 in processor-based device 38 .
- fourth fan modules 142 may be used in devices where non-redundant, i.e. non-hot swap fans are employed. For example, hot swap fans typically are not required in a workstation.
- the same methodology for securing removable cooling fans may be used in systems that require hot swap fans and those systems, such as workstations, that do not.
- the above techniques may be used to secure cooling fans in rack-mounted systems, such as servers, and desktop systems, such as workstations.
Abstract
Description
- Electronic devices typically generate heat during operation due to the flow of electricity through the device. Some electronic components are susceptible to damage if this heat is not removed. Consequently, various methods have been developed to remove heat from within electronic devices and/or electronic components. Passive methods use natural convection to remove heat. For example, the electronic device may have a housing with vents to let cool air flow into the device and hot air flow out. Other electronic devices use active methods, such as electric fans built into the housing, to provide a flow of cooling air through the device.
- The processors in many processor-based devices are susceptible to heat damage. Consequently, at least one cooling fan usually is needed to remove the heat from the processor to prevent the processor from being damaged. For example, a typical home computer has a cooling fan to remove the heat produced by the electronic components, including the processor, housed therein. In other computer systems, several fans may be used to remove heat from within the device. In mission critical systems, such as servers, redundant fans may be provided that are operable to respond when another fan fails, either by initiating operation or by increasing speed.
- Several different sizes and types of fans may be used in electronic devices, such as processor-based devices. Unfortunately, each type of fan typically requires its own unique method of installation. In addition, the securing methods may involve numerous parts, such as threaded fasteners. Furthermore, these fans typically are bulky and may not be disposed in a space-efficient side-by-side arrangement. Alternatively, fan connectors and finger guards may be oriented in such a manner that they interfere with the flow of air through the fan or otherwise add to the difficulty of installing the fan.
- According to an embodiment of the present invention, a removable fan module is featured. The removable fan module comprises a first member securable to a fan. The first member comprises a portion adapted to engage a corresponding portion of an electrical device.
- According to another embodiment of the present invention, an electronic device is featured. The electronic device comprises a plurality of removable fan modules. At least one of the plurality of removable fan modules having a first type of fan and at least one of the plurality of removable fan modules having a second type of fan. The removable fan module comprises a fan retainer securable to the first and second type of fan. A portion of the electronic device and the fan retainer are adapted to enable the fan retainer to be received by the electronic device.
- According to another embodiment of the present invention, a method of removably securing a plurality of fans within an electronic device is featured. The method comprises securing a common fan retainer to at least one of the plurality of fans, the common fan retainer being operable to secure the at least one of plurality of fans to the electronic device. The method comprises disposing the fans and common fan retainers within the electronic device to secure the plurality of fans to the electronic device.
- Exemplary embodiments will hereafter be described with reference to the accompanying drawings, wherein like reference numerals denote like elements, and:
- FIG. 1 illustrates a block-diagram of a processor-based system according to an embodiment of the present invention;
- FIG. 2 is a perspective view illustrating an embodiment of a processor-based system, in accordance with an embodiment of the present invention;
- FIG. 3 is a perspective view of a first removable fan of FIG. 2;
- FIG. 4 is a top view of a portion of the chassis of the processor-based system of FIG. 2;
- FIG. 5 is a front perspective view of a fan retainer illustrated in FIG. 3;
- FIG. 6 is a rear perspective view of the fan retainer of FIG. 5;
- FIG. 7 is a perspective view of a second removable fan of FIG. 2;
- FIG. 8 is a perspective view of a third removable fan of FIG. 2; and
- FIG. 9 is a perspective view of a fourth removable fan, in accordance with an alternative embodiment of the present invention.
- Referring generally to FIG. 1, a block diagram is illustrated depicting an exemplary processor-based device, generally designated by
reference numeral 20. The processor-baseddevice 20 may be any of a variety of different devices, such as a personal computer or a server. - The illustrated processor-based
device 20 uses aprocessor 22 to control the operation ofdevice 20.Processor 22 may be a microprocessor, such as used in a personal computer, or other type of processor. Processor-baseddevice 22 has apower supply 24 to supply power to the other components of the system. Various additional components ofsystem 20 may be coupled toprocessor 22. For instance, auser interface 26 may be coupled toprocessor 22 to allow an operator to control some or all of the functions of the device. Examples of user interfaces include a keyboard, a mouse, or a joystick. Amonitor 28 may be coupled to theprocessor 22 to allow an operator to view visual information provided by the device. This information may be displayed on the monitor via a graphical user interface. Acommunications port 30 also may be used to coupleprocessor 22 toperipheral devices 32, such as a modem or printer. - Programming instructions are often used to control the operation of
processor 22 and these programming instructions are typically stored in electronic memory. There are several different types of electronic memory available for use in processor-based devices. For example, theprocessor 22 may be coupled tovolatile memory 34. Volatile memory may include dynamic random access memory (DRAM) and/or static random access memory (SRAM) packaged, for example, as a single-inline memory module (SIMM) or as a dual-inline memory module (DIMM).Processor 22 also may be coupled tonon-volatile memory 36. Non-volatilememory 36 may include a read only memory (ROM), such as an erasable programmable read-only memory (EPROM), to be used in conjunction with the volatile memory. Thenon-volatile memory 36 may include a high capacity memory such as a hard disk drive (HDD) or tape drive memory. - Referring generally to FIG. 2, an embodiment of a processor-based
device 38 is illustrated. In this embodiment, processor-baseddevice 38 is a server and comprises achassis 40 and a number of electronic components housed withinchassis 40.Chassis 40 may comprise sheet metal, or other materials may be used. In this embodiment,chassis 40 comprises abase 42 havingsides 44. A number ofventilation holes 46 are provided inchassis 40.Chassis 40 also has a plurality ofdividers 48 secured tobase 42 that are used to separate various portions of the chassis and to secure components tobase 42. In the illustrated embodiment,dividers 40 comprise folded sheet metal. However, other materials also may be used to constructdividers 40. - Several
removable fans 50 are provided to produce a flow ofair 52 throughdevice 38 to cool the components housed therein. In this embodiment, three different types of fan are utilized. However, fans of the same type or fans of other types may be used. In addition,fans 50 can have a variety of different dimensions. Ventilation holes 46 are oriented at each end ofbase 44 and the cover so thatair 52 is drawn in at one end of the device and exited at the opposite end. However, other orientations of ventilation holes 46 may be used.Dividers 48 also may be used to guide the flow ofair 52 throughdevice 38. - In the illustrated embodiment, processor-based-
device 38 has a pair ofprocessors 54. Acover 56 is disposed overprocessors 54 to guideair 52 over theprocessors 54. In addition,ducts 58 are provided to guideair 52 intocover 56. In this embodiment, twofan modules 60 of the plurality offans 50 primarily are used to provide a flow ofair 52 to coolprocessors 54. Several different operating strategies may be used to operatefan modules 60. In one strategy, both fan modules are operated at low speed. If one of the fan modules fails, then the speed of the other fan module is increased to compensate for the loss of the failed fan. Alternatively, only one fan module at a time may be operated. If the operating fan fails, then the non-operating fan is turned on to maintain the flow ofair 52. The flow ofair 52 provided byfan modules 60 may cool other components located within thedevice 38, such aspower supplies 62 andoptical drive 64. In addition, other fan modules may assist in the cooling of theprocessors 54. - In this embodiment, processor-based
device 38 also comprises a plurality of DIMM's 66. However, other memory modules may be used. Also, asecond fan module 68 primarily is utilized to provide a flow ofair 52 to cool the DIMM's. - Processor-based
device 38 may also comprise aPCI cage 70.PCI cage 70 houses a number of interface cards for connecting processor-baseddevice 38 to an electronic communication system. Processor-baseddevice 38 also comprisesseveral HDDs 72. A flow ofair 52 for cooling the components withinPCI cage 70 and theHDDs 72 is provided primarily by athird fan module 74. However,third fan module 74 also may be used to cool other components and other fan modules may assist in the cooling of the components withinPCI cage 70 andHDDs 72. - In the illustrated embodiment,
fan modules 60,second fan module 68, andthird fan module 74 are hot-swap fans, i.e., these fans may be installed and removed without securing power to, or interrupting operation of, processor-baseddevice 38. Redundant fans are provided so that if one of the fans fails, operation of the device may continue until a replacement fan is installed. In addition, each fan is adapted to be blind-mated to a corresponding connector withinchassis 40 when the fan is installed withindevice 38. Also, each fan receives power through the connectors, and fan operation, such as fan speed, may be controlled via signals transmitted via the connectors. - The plurality of
fans 50 utilize a common methodology for removably installing the fans within thechassis 40. The common methodology enables installation and removal without the use of fasteners or tools. In addition, the common methodology enables fans of different dimensions to be installed with common components. - Referring generally to FIGS. 2-6, the illustrated
fan module 60 comprises afan retainer 76, afirst fan 78, and aFan top piece 80.Fan retainer 76 comprises a pair ofmating flanges 82 adapted to slidingly engage a pair of catchingflanges 84 located on adivider 48 secured to chassis 40 (See FIG. 4).Fan retainer 76 is utilized with all three types of fans described with respect to the illustrated embodiment. In this embodiment,fan retainer 76 comprises a plastic material.Fan retainer 76 also comprises a pair ofalignment notches 86 adapted to engagecorresponding alignment tabs 88 located onbase 42 ofchassis 40 when there is proper alignment betweenfan module 60 and chassis 40 (See FIG. 4).Alignment tabs 88 prevent a fan module from being fully inserted when there is misalignment between the fan module andchassis 40, thereby indicating misalignment to an installer. Fan modules are blocked from removal fromchassis 40 by acover 89. - Referring generally to FIG. 3,
fan module 60 may be adapted to accommodate afan 78.Fan 78 comprises arotatable fan blade 90 driven by an electric motor and a fixed air guide downstream ofrotatable fan blade 90. Afinger guard 92 is disposed on each end offan module 60 to prevent a finger from contactingfan blade 90.Fan retainer 76 may have arecess 94 on each corner. Eachrecess 94 is adapted to receive a portion of afinger guard 92 to securefinger guard 92 to fanretainer 76. In this embodiment,fan retainer 76 is secured to fan 78 by a plurality ofrivets 98. However, other fasteners may be used. -
Fan top piece 80 is adapted to electrically couplefan module 60 to a fan power system within processor-baseddevice 38.Fan top piece 80 is secured tofan module 60 by atongue 100 that engages a slot infan retainer 76 and by a plurality ofrivets 102 secured to fan 78 through thefan top piece 80. However, other types of fasteners may be used.Fan top piece 80 also has a pair of finger grips 104 to facilitate gripping offan module 60.Fan top piece 80 also has anidentifier 106 to indicate that this is a specific type of fan: in the illustrated embodiment a Type 1 fan. -
Fan module 60 has aninlet side 108 and anoutlet side 110. Anarrow 112 is provided onfan top piece 80 to indicate the flow of air from theinlet side 108 to theoutlet side 110. In this embodiment,fan retainer 76 is disposed on theinlet side 108 of the fan. Alternatively,fan retainer 76 may be disposed on theoutlet side 110 of the fan. - The illustrated embodiment of
fan top piece 80 has aconnector portion 114 housing a firstelectrical connector 116.Connector 116 is coupled by power and control leads 118 to the motor offan module 60. -
Connector portion 114 forms a protective tray to protect power and control leads 118. Where eachfan module 60 is to be installed withinchassis 40, catchingflanges 84 and a secondelectrical connector 120 are oriented within thechassis 40 to enable the first and second electrical connectors to be blind-mated when thefirst fan module 60 is inserted. - Referring again to FIGS. 2-4, as
fan module 60 is guided intochassis 40 by themating flanges 82 and catchingflanges 84, firstelectrical connector 116 is guided into engagement with secondelectrical connector 120. In this embodiment,connector portion 114 offan top portion 80 is cantilevered to displace firstelectrical connector 116 axially and in line with airflow throughfan module 60. This displacement enables twofan modules 60 to be installed withinchassis 40 so thatfans 78 are in close, side-by-side arrangement, as illustrated in FIG. 4. In one embodiment,fans 78 are disposed approximately 1.5 mm from each other. As discussed above,alignment notches 86 andalignment tabs 88 facilitate the blind-mating of each fan module by preventing the fan module from being fully inserted when there is a misalignment between the fan module andchassis 40. - Referring generally to FIG. 7,
second fan module 68 is illustrated.Second fan module 68 comprises afan retainer 76, afan 122, a fan 124, and a secondfan top piece 126.Fan 122 and fan 124 each house a motor and fan blade.Second fan module 68 also may be used with a single fan having the same depth asfans 122 and 124 when placed together. Several different operating strategies also may be employed to operatefans 122 and 124. For example, both fans may be operated at a low speed. If one of the fans fails, then the speed of the other fan is increased to compensate for the loss of the failed fan. Alternatively, only one fan at a time may be operated. If the operating fan fails, then the non-operating fan is turned on to maintain the flow ofair 52. - Second
fan top piece 126 is configured for use withsecond fan module 68. Secondfan top piece 126 also is adapted with aconnector portion 128.Connector portion 128 houses a firstelectrical connector 116 coupled by power and control leads 118 to the motors withinsecond fans 122 and 124.Connector portion 128 of secondfan top piece 126 displaces firstelectrical connector 116 to the side ofsecond fan module 68, and transverse to the direction of airflow therethrough. Catchingflanges 84 and secondelectrical connector 120 are oriented within thechassis 40 to connect the first and second electrical connectors whensecond fan module 68 is fully inserted intochassis 40. Assecond fan module 68 is guided intochassis 40 by themating flanges 82 and catchingflanges 84, firstelectrical connector 116 is guided into engagement with secondelectrical connector 120. - A plurality of
fasteners 130 are employed to securefan retainer 76,fan 122, fan 124, and secondfan top piece 126 together. Secondfan top piece 126 also hastongue 100 adapted to extend under a portion offan retainer 76. In this embodiment, secondfan top piece 126 also has anidentifier 132 to indicate the fan module type as a Type 2 fan.Second fan module 68 also has aninlet side 108 and anoutlet side 110. Anarrow 112 is provided on Secondfan top piece 126 to indicate the direction of airflow from theinlet side 108 to theoutlet side 110. In this embodiment,fan retainer 76 is disposed on theinlet side 108 of the second-type fan module 68. Alternatively,fan retainer 76 may be disposed on theoutlet side 110 offan module 68. - Referring generally to FIG. 8,
third fan module 74 is illustrated.Third fan module 74 comprises afan retainer 76, afan 134, and a thirdfan top piece 136. In the illustrated embodiment,fan 134 has two counter-rotating fan blades.Third fan module 74 also may be used with two fans having half the width ofthird fan 134, etc. - Third
fan top piece 136 is configured for use with third-type fan module 74. Thirdfan top piece 136 has aconnector portion 138 housing a maleelectrical connector 116 coupled by power and control leads 118 to the motor withinfan housing 134.Connector portion 138 is adapted to enable firstelectrical connector 116 to be blind-mated with a corresponding secondelectrical connector 120 located onchassis 40. Asthird fan module 74 is guided intochassis 40 by themating flanges 82 and catchingflanges 84, the firstelectrical connector 116 is guided into engagement with secondelectrical connector 120. - In this embodiment, third
fan top piece 136 also has anidentifier 140 to indicate that this is a Type 3 fan.Third fan module 74 has aninlet side 108 and anoutlet side 110. Anarrow 112 is provided onfan top portion 136 to indicate the direction of airflow from theinlet side 108 to theoutlet side 110. In this embodiment,fan retainer 76 is disposed on theoutlet side 110 of the second-type fan module 68. Alternatively,fan retainer 76 may be disposed on theinlet side 108 offan module 68. - Referring generally to FIG. 9, a
fourth fan module 142 is illustrated. In this embodiment,fourth fan module 142 is a non-hot swap fan module.Fourth fan module 142 comprises afan retainer 76, afourth fan 144, and aseparate connector 146 connected by power and control leads 118 to the motor withinfourth fan 144.Fourth fan module 142 may be used instead of, or to replace, some or all of the plurality offan modules 50. For example,fourth fan modules 142 may be used to replacefan modules 60 in processor-baseddevice 38. In addition,fourth fan modules 142 may be used in devices where non-redundant, i.e. non-hot swap fans are employed. For example, hot swap fans typically are not required in a workstation. Thus, the same methodology for securing removable cooling fans may be used in systems that require hot swap fans and those systems, such as workstations, that do not. In addition, the above techniques may be used to secure cooling fans in rack-mounted systems, such as servers, and desktop systems, such as workstations. - While the subject matter may be susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in detail herein. However, it should be understood that the subject matter is not intended to be limited to the particular forms disclosed. Rather, the subject matter is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the subject matter as defined by the following appended claims.
Claims (24)
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US10/396,535 US6795314B1 (en) | 2003-03-25 | 2003-03-25 | Removable fan module and electronic device incorporating same |
Applications Claiming Priority (1)
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US10/396,535 US6795314B1 (en) | 2003-03-25 | 2003-03-25 | Removable fan module and electronic device incorporating same |
Publications (2)
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US6795314B1 US6795314B1 (en) | 2004-09-21 |
US20040190246A1 true US20040190246A1 (en) | 2004-09-30 |
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US10/396,535 Expired - Lifetime US6795314B1 (en) | 2003-03-25 | 2003-03-25 | Removable fan module and electronic device incorporating same |
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060120040A1 (en) * | 2004-12-06 | 2006-06-08 | Chenbro Micom Co., Ltd. | [mobile fan module] |
US20070053771A1 (en) * | 2005-09-05 | 2007-03-08 | Chin-Yi Wu | Electronic product having airflow-guiding structure and method for fabricating the airflow-guiding structure thereof |
US20070242426A1 (en) * | 2004-01-08 | 2007-10-18 | Apple Inc. | Quick release structures for a computer |
US20090056359A1 (en) * | 2007-08-30 | 2009-03-05 | Mark Germagian | System and method for cooling electronic equipment |
US20090147466A1 (en) * | 2007-12-10 | 2009-06-11 | Wistron Corporation | Fixing device and computer |
US20140029191A1 (en) * | 2012-07-30 | 2014-01-30 | Kevin Terwilliger | Information Handling System Low Profile Pluggable Cooling Fan And Connector |
CN103823524A (en) * | 2012-11-16 | 2014-05-28 | 英业达科技有限公司 | Server and electronic device |
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US9982681B2 (en) | 2013-10-10 | 2018-05-29 | Gentherm Automotive Systems (China) Ltd. | Externally programmable fan |
US20190200481A1 (en) * | 2017-12-22 | 2019-06-27 | Seagate Technology Llc | Suspended fan modules |
US11497136B2 (en) * | 2019-07-03 | 2022-11-08 | Mellanox Technologies, Ltd. | Universal replaceable fan unit for datacenters |
US11627684B2 (en) * | 2020-03-05 | 2023-04-11 | Mellanox Technologies, Ltd. | Bi-directional fan |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6817889B2 (en) * | 2001-03-27 | 2004-11-16 | Delta Electronics Inc. | Heat-dissipating module |
US7054155B1 (en) * | 2003-03-17 | 2006-05-30 | Unisys Corporation | Fan tray assembly |
US6851925B2 (en) * | 2003-07-02 | 2005-02-08 | Inventec Corporation | Mechanism for fast fastening fans of server |
TWI236336B (en) * | 2003-10-21 | 2005-07-11 | Quanta Comp Inc | Electronic product having airflow-guiding device |
US6979169B2 (en) * | 2003-11-21 | 2005-12-27 | Broan-Nutone Llc | Modular ventilating exhaust fan assembly and method |
US20050139348A1 (en) * | 2003-12-30 | 2005-06-30 | Delta Electronics, Inc. | Hot swap fan |
US7035102B2 (en) * | 2004-01-08 | 2006-04-25 | Apple Computer, Inc. | Apparatus for air cooling of an electronic device |
US20050241802A1 (en) * | 2004-04-29 | 2005-11-03 | Hewlett-Packard Development Company, L.P. | Liquid loop with flexible fan assembly |
US7436662B2 (en) * | 2005-07-19 | 2008-10-14 | International Business Machines Corporation | Hot swappable cooling fan system |
US7623344B2 (en) * | 2005-08-09 | 2009-11-24 | Dell Products L.P. | Method and apparatus for mounting a fan in a chassis |
US8189599B2 (en) * | 2005-08-23 | 2012-05-29 | Rpx Corporation | Omni-protocol engine for reconfigurable bit-stream processing in high-speed networks |
US7251135B2 (en) * | 2005-09-08 | 2007-07-31 | International Business Machines Corporation | Easy release server cooling fan with integrated spring and method for using same |
US20070103862A1 (en) * | 2005-11-10 | 2007-05-10 | David Costello | Chassis with positive pressure |
US7535707B2 (en) * | 2005-11-17 | 2009-05-19 | Rackable Systems, Inc. | Power supply cooling system |
US20070121290A1 (en) * | 2005-11-30 | 2007-05-31 | Datavan International Corp. | Detachable fan assembly |
CN2874090Y (en) * | 2005-12-09 | 2007-02-28 | 鸿富锦精密工业(深圳)有限公司 | Fan fixing device |
US7827442B2 (en) | 2006-01-23 | 2010-11-02 | Slt Logic Llc | Shelf management controller with hardware/software implemented dual redundant configuration |
WO2007112109A2 (en) * | 2006-03-24 | 2007-10-04 | Slt Logic Llc | Modular chassis providing scalable mechanical, electrical and environmental functionality for microtca and advanced tca boards |
US20080261508A1 (en) * | 2007-04-23 | 2008-10-23 | Hanway Technology Co., Ltd. | Exhaust system with easy installation |
US7515413B1 (en) * | 2007-04-27 | 2009-04-07 | Cisco Technology, Inc. | Fan field replaceable unit |
US8202047B2 (en) * | 2007-06-07 | 2012-06-19 | Hewlett-Packard Development Company, L.P. | Fan module latching device |
EP2168413A4 (en) * | 2007-06-27 | 2016-11-30 | Thomson Licensing | Fan and storage device mounting assembly for electronic device |
US8784167B2 (en) * | 2007-12-10 | 2014-07-22 | Cisco Technology, Inc. | Fan suspension for reduction of noise |
DE102008005723A1 (en) * | 2008-01-23 | 2009-07-30 | Wincor Nixdorf International Gmbh | Power supply fan |
US9426903B1 (en) | 2008-06-27 | 2016-08-23 | Amazon Technologies, Inc. | Cooling air stack for computer equipment |
JP5164706B2 (en) * | 2008-07-17 | 2013-03-21 | オリンパスメディカルシステムズ株式会社 | In-device cooling structure and ultrasonic observation device |
CN101639712A (en) * | 2008-07-31 | 2010-02-03 | 英业达股份有限公司 | Server |
TWI359352B (en) * | 2009-04-17 | 2012-03-01 | Inventec Corp | Case of sever |
CN102129273A (en) * | 2010-01-16 | 2011-07-20 | 鸿富锦精密工业(深圳)有限公司 | Computer system |
US20110176270A1 (en) * | 2010-01-19 | 2011-07-21 | Ku-Yang Chou | System rack for accessing hard disks in dual directions |
CN102193589A (en) * | 2010-03-15 | 2011-09-21 | 英业达股份有限公司 | Auxiliary operation system of server |
CN102207751A (en) * | 2010-03-29 | 2011-10-05 | 鸿富锦精密工业(深圳)有限公司 | Computer system |
US8638553B1 (en) | 2010-03-31 | 2014-01-28 | Amazon Technologies, Inc. | Rack system cooling with inclined computing devices |
US8755192B1 (en) * | 2010-03-31 | 2014-06-17 | Amazon Technologies, Inc. | Rack-mounted computer system with shock-absorbing chassis |
US9894808B2 (en) | 2010-03-31 | 2018-02-13 | Amazon Technologies, Inc. | Compressed air cooling system for data center |
US9622387B1 (en) | 2010-03-31 | 2017-04-11 | Amazon Technologies, Inc. | Rack-mounted air directing device with scoop |
US8045328B1 (en) * | 2010-05-04 | 2011-10-25 | Chenbro Micom Co., Ltd. | Server and cooler moduel arrangement |
CN102289268A (en) * | 2010-06-17 | 2011-12-21 | 英业达股份有限公司 | rack server |
US8477491B1 (en) * | 2010-09-20 | 2013-07-02 | Amazon Technologies, Inc. | System with rack-mounted AC fans |
US10492331B1 (en) | 2010-09-29 | 2019-11-26 | Amazon Technologies, Inc. | System and method for cooling power distribution units |
CN102799238A (en) * | 2011-05-25 | 2012-11-28 | 鸿富锦精密工业(深圳)有限公司 | Electronic device |
CN102878094A (en) * | 2011-07-14 | 2013-01-16 | 鸿富锦精密工业(深圳)有限公司 | Fan combination |
CN103135718A (en) * | 2011-12-03 | 2013-06-05 | 鸿富锦精密工业(深圳)有限公司 | Heat dissipation system |
US9095070B2 (en) | 2011-12-05 | 2015-07-28 | Amazon Technologies, Inc. | Partial-width rack-mounted computing devices |
US8773861B2 (en) | 2011-12-15 | 2014-07-08 | Amazon Technologies, Inc. | Reconfigurable shelf for computing modules |
US8867214B2 (en) | 2011-12-15 | 2014-10-21 | Amazon Technologies, Inc. | Modular server design for use in reconfigurable server shelf |
US8720043B2 (en) | 2011-12-15 | 2014-05-13 | Amazon Technologies, Inc. | Method of allocating resources in a rack system |
US10082857B1 (en) | 2012-08-07 | 2018-09-25 | Amazon Technologies, Inc. | Cooling electrical systems based on power measurements |
US9894809B1 (en) | 2013-02-28 | 2018-02-13 | Amazon Technologies, Inc. | System for supplying cooling air from sub-floor space |
US9426932B2 (en) | 2013-03-13 | 2016-08-23 | Silicon Graphics International Corp. | Server with heat pipe cooling |
US20140268551A1 (en) * | 2013-03-15 | 2014-09-18 | Silicon Graphics International Corp. | Enclosure high pressure push-pull airflow |
US9612920B2 (en) | 2013-03-15 | 2017-04-04 | Silicon Graphics International Corp. | Hierarchical system manager rollback |
US10037061B1 (en) | 2013-04-30 | 2018-07-31 | Amazon Technologies, Inc. | Multiple-stage cooling system for rack |
US9326415B2 (en) * | 2013-09-14 | 2016-04-26 | Seagate Technology Llc | Chassis for storage devices |
US9253919B2 (en) * | 2013-11-05 | 2016-02-02 | Brocade Communications Systems, Inc. | Electronic component cooling system and method |
CN104731168B (en) * | 2013-12-18 | 2018-04-20 | 鸿富锦精密电子(天津)有限公司 | Electronic device |
WO2016053323A1 (en) * | 2014-09-30 | 2016-04-07 | Hewlett Packard Enterprise Development Lp | Modular utilities |
TWM509369U (en) * | 2015-07-02 | 2015-09-21 | Quanta Comp Inc | Modular electronic device |
US9769958B2 (en) * | 2015-09-21 | 2017-09-19 | Ciena Corporation | Modular fan and motherboard assembly |
US10368466B1 (en) | 2015-10-06 | 2019-07-30 | Amazon Technologies, Inc. | Rack mountable cooling canister |
US10624241B1 (en) | 2015-10-06 | 2020-04-14 | Amazon Technologies, Inc. | Rack mountable thermal regulation system |
US9642286B1 (en) | 2015-12-14 | 2017-05-02 | Amazon Technologies, Inc. | Coordinated control using rack mountable cooling canisters |
US10321608B1 (en) | 2015-12-14 | 2019-06-11 | Amazon Technologies, Inc. | Coordinated cooling using rack mountable cooling canisters |
US10184478B2 (en) * | 2016-05-12 | 2019-01-22 | In Win Development, Inc. | Fan device with modular functionality |
US10235322B1 (en) * | 2016-06-22 | 2019-03-19 | EMC IP Holding Company LLC | Hot-swappable adapter system for non-hot-swappable expansion cards |
US10153603B1 (en) | 2016-06-22 | 2018-12-11 | EMC IP Holding Company LLC | Adapter system |
CN206322089U (en) * | 2016-11-17 | 2017-07-11 | 广州视源电子科技股份有限公司 | A kind of PC modular assemblies |
US11083439B2 (en) | 2017-06-05 | 2021-08-10 | Clarius Mobile Health Corp. | Cooling unit for an ultrasound imaging apparatus, and related ultrasound systems |
USD989749S1 (en) * | 2021-02-03 | 2023-06-20 | Sonos, Inc. | Audio device rack mount |
US11822810B2 (en) * | 2021-10-25 | 2023-11-21 | Dell Products L.P. | Removable memory device of a network switch for an information handling system |
Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4356531A (en) * | 1979-03-16 | 1982-10-26 | Data General, Inc. | Computer mounting assembly |
US4728160A (en) * | 1986-10-22 | 1988-03-01 | Digital Equipment Corporation | Cabinet for a computer assembly |
US4739445A (en) * | 1985-07-29 | 1988-04-19 | Microscience Corporation | Electronic computer cabinetry having fan and power supply drawers and connector port arrangement |
US5208730A (en) * | 1991-06-27 | 1993-05-04 | Compaq Computer Corporation | Computer cooling fan vibration isolation apparatus |
US5613906A (en) * | 1995-07-20 | 1997-03-25 | Elonex I.P. Holdings, Ltd. | Method and apparatus for waste heat removal from a computer enclosure |
US5717570A (en) * | 1995-10-06 | 1998-02-10 | Elonex I.P. Holdings Ltd. | Enhanced mini-tower computer architecture |
US5831525A (en) * | 1997-09-18 | 1998-11-03 | Harvey; James C. | Filtered air, temperature controlled removable computer cartridge devices |
US5936836A (en) * | 1997-12-19 | 1999-08-10 | Dell U.S.A., L.P. | Computer with an improved internal cooling system |
US5949646A (en) * | 1998-07-31 | 1999-09-07 | Sun Microsystems, Inc. | Compact computer having a redundant air moving system and method thereof |
US6059009A (en) * | 1997-11-20 | 2000-05-09 | Haiber; Gerd | Device and technique to hang decorative of functional panel with grommets |
US6069792A (en) * | 1997-09-16 | 2000-05-30 | Nelik; Jacob | Computer component cooling assembly |
US6075698A (en) * | 1998-10-27 | 2000-06-13 | Ads, The Power Resource, Inc. | Removable fan for rack mounted rectifiers |
US6094345A (en) * | 1996-05-14 | 2000-07-25 | Hewlett-Packard Company | Component cooling arrangement in electronic equipment with internal power supply |
US6101459A (en) * | 1997-08-15 | 2000-08-08 | Compaq Computer Corporation | System and associated method for cooling components within a computer system |
US6176299B1 (en) * | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
US6244953B1 (en) * | 1999-05-25 | 2001-06-12 | 3Com Corporation | Electronic device fan mounting system |
US6288898B1 (en) * | 1999-12-20 | 2001-09-11 | Dell Usa, L.P. | Apparatus for mounting and cooling a system components in a computer |
US6311767B1 (en) * | 1999-05-26 | 2001-11-06 | Intel Corporation | Computer fan assembly |
US6313988B1 (en) * | 1999-09-28 | 2001-11-06 | Hong T. Ha | Server with reduced space requirement |
US6373698B1 (en) * | 2001-05-03 | 2002-04-16 | International Business Machines Corporation | Apparatus for cooling a computer system |
US6375440B2 (en) * | 1999-09-30 | 2002-04-23 | Fujitsu Limited | Fan unit, fan assembly, and an apparatus comprising the fan assembly |
US6400568B1 (en) * | 2001-07-11 | 2002-06-04 | Sun Microsystems, Inc. | Method and apparatus for cooling electronic components |
US6459575B1 (en) * | 2001-05-15 | 2002-10-01 | Hewlett-Packard Company | Cooling module for portable computer |
US6587342B1 (en) * | 2002-07-23 | 2003-07-01 | Inventec Corporation | Snap coupling cooling fan module |
US6663416B2 (en) * | 2001-03-27 | 2003-12-16 | Delta Electronics Inc. | Heat-dissipating module |
US6674641B2 (en) * | 2001-07-16 | 2004-01-06 | Dell Products L.P. | Latch for computer chassis fan assembly |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD297455S (en) | 1986-02-18 | 1988-08-30 | Beck-Tech, Incorporated | Housing for a computer fan |
US6058009A (en) | 1998-07-14 | 2000-05-02 | Dell Usa, L.P. | Computer with improved internal cooling system |
-
2003
- 2003-03-25 US US10/396,535 patent/US6795314B1/en not_active Expired - Lifetime
Patent Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4356531A (en) * | 1979-03-16 | 1982-10-26 | Data General, Inc. | Computer mounting assembly |
US4739445A (en) * | 1985-07-29 | 1988-04-19 | Microscience Corporation | Electronic computer cabinetry having fan and power supply drawers and connector port arrangement |
US4728160A (en) * | 1986-10-22 | 1988-03-01 | Digital Equipment Corporation | Cabinet for a computer assembly |
US5208730A (en) * | 1991-06-27 | 1993-05-04 | Compaq Computer Corporation | Computer cooling fan vibration isolation apparatus |
US5613906A (en) * | 1995-07-20 | 1997-03-25 | Elonex I.P. Holdings, Ltd. | Method and apparatus for waste heat removal from a computer enclosure |
US5717570A (en) * | 1995-10-06 | 1998-02-10 | Elonex I.P. Holdings Ltd. | Enhanced mini-tower computer architecture |
US6094345A (en) * | 1996-05-14 | 2000-07-25 | Hewlett-Packard Company | Component cooling arrangement in electronic equipment with internal power supply |
US6101459A (en) * | 1997-08-15 | 2000-08-08 | Compaq Computer Corporation | System and associated method for cooling components within a computer system |
US6069792A (en) * | 1997-09-16 | 2000-05-30 | Nelik; Jacob | Computer component cooling assembly |
US6377455B1 (en) * | 1997-09-16 | 2002-04-23 | Jacob Nelik | Computer component cooling assembly |
US5831525A (en) * | 1997-09-18 | 1998-11-03 | Harvey; James C. | Filtered air, temperature controlled removable computer cartridge devices |
US6059009A (en) * | 1997-11-20 | 2000-05-09 | Haiber; Gerd | Device and technique to hang decorative of functional panel with grommets |
US5936836A (en) * | 1997-12-19 | 1999-08-10 | Dell U.S.A., L.P. | Computer with an improved internal cooling system |
US5949646A (en) * | 1998-07-31 | 1999-09-07 | Sun Microsystems, Inc. | Compact computer having a redundant air moving system and method thereof |
US6075698A (en) * | 1998-10-27 | 2000-06-13 | Ads, The Power Resource, Inc. | Removable fan for rack mounted rectifiers |
US6176299B1 (en) * | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
US6244953B1 (en) * | 1999-05-25 | 2001-06-12 | 3Com Corporation | Electronic device fan mounting system |
US6311767B1 (en) * | 1999-05-26 | 2001-11-06 | Intel Corporation | Computer fan assembly |
US6313988B1 (en) * | 1999-09-28 | 2001-11-06 | Hong T. Ha | Server with reduced space requirement |
US6375440B2 (en) * | 1999-09-30 | 2002-04-23 | Fujitsu Limited | Fan unit, fan assembly, and an apparatus comprising the fan assembly |
US6288898B1 (en) * | 1999-12-20 | 2001-09-11 | Dell Usa, L.P. | Apparatus for mounting and cooling a system components in a computer |
US6663416B2 (en) * | 2001-03-27 | 2003-12-16 | Delta Electronics Inc. | Heat-dissipating module |
US6373698B1 (en) * | 2001-05-03 | 2002-04-16 | International Business Machines Corporation | Apparatus for cooling a computer system |
US6459575B1 (en) * | 2001-05-15 | 2002-10-01 | Hewlett-Packard Company | Cooling module for portable computer |
US6400568B1 (en) * | 2001-07-11 | 2002-06-04 | Sun Microsystems, Inc. | Method and apparatus for cooling electronic components |
US6674641B2 (en) * | 2001-07-16 | 2004-01-06 | Dell Products L.P. | Latch for computer chassis fan assembly |
US6587342B1 (en) * | 2002-07-23 | 2003-07-01 | Inventec Corporation | Snap coupling cooling fan module |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8425286B2 (en) * | 2004-01-08 | 2013-04-23 | Apple Inc. | Quick release structures for a computer |
US20070242426A1 (en) * | 2004-01-08 | 2007-10-18 | Apple Inc. | Quick release structures for a computer |
US9207724B2 (en) | 2004-01-08 | 2015-12-08 | Apple Inc. | Quick release structures for a memory drive |
US7259962B2 (en) * | 2004-12-06 | 2007-08-21 | Chenbro Micom Co., Ltd. | Mobile fan module |
US20060120040A1 (en) * | 2004-12-06 | 2006-06-08 | Chenbro Micom Co., Ltd. | [mobile fan module] |
US20070053771A1 (en) * | 2005-09-05 | 2007-03-08 | Chin-Yi Wu | Electronic product having airflow-guiding structure and method for fabricating the airflow-guiding structure thereof |
GB2465509B (en) * | 2007-08-30 | 2012-08-22 | Opengate Data Systems | System and method for cooling electronic equipment |
GB2465509A (en) * | 2007-08-30 | 2010-05-26 | Opengate Data Systems | System and method for cooling electronic equipment |
US9681587B2 (en) | 2007-08-30 | 2017-06-13 | Pce, Inc. | System and method for cooling electronic equipment |
WO2009032237A1 (en) * | 2007-08-30 | 2009-03-12 | Opengate Data Systems | System and method for cooling electronic equipment |
US20090056359A1 (en) * | 2007-08-30 | 2009-03-05 | Mark Germagian | System and method for cooling electronic equipment |
US7852623B2 (en) * | 2007-12-10 | 2010-12-14 | Wistron Corporation | Fixing device and computer |
US20090147466A1 (en) * | 2007-12-10 | 2009-06-11 | Wistron Corporation | Fixing device and computer |
US20140029191A1 (en) * | 2012-07-30 | 2014-01-30 | Kevin Terwilliger | Information Handling System Low Profile Pluggable Cooling Fan And Connector |
US8897008B2 (en) * | 2012-07-30 | 2014-11-25 | Dell Products L.P. | Information handling system low profile pluggable cooling fan and connector |
CN103823524A (en) * | 2012-11-16 | 2014-05-28 | 英业达科技有限公司 | Server and electronic device |
TWI512441B (en) * | 2012-11-23 | 2015-12-11 | Inventec Corp | Server and electronic device |
US9982681B2 (en) | 2013-10-10 | 2018-05-29 | Gentherm Automotive Systems (China) Ltd. | Externally programmable fan |
US10890192B2 (en) | 2013-10-10 | 2021-01-12 | Mdr Arcom Llc | Externally programmable fan |
EP3302012A1 (en) * | 2016-10-02 | 2018-04-04 | Tdk-Lambda Ltd | Rackmount chassis |
US20190200481A1 (en) * | 2017-12-22 | 2019-06-27 | Seagate Technology Llc | Suspended fan modules |
US11019748B2 (en) * | 2017-12-22 | 2021-05-25 | Seagate Technology Llc | Suspended fan modules |
US11497136B2 (en) * | 2019-07-03 | 2022-11-08 | Mellanox Technologies, Ltd. | Universal replaceable fan unit for datacenters |
US11627684B2 (en) * | 2020-03-05 | 2023-04-11 | Mellanox Technologies, Ltd. | Bi-directional fan |
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